Zero insertion force....taking a chip out

So far I have taken two mobos apart.
One of the CPU chips was bonded to the heat sink. The other was left
in the socket.

Which is more common?

Terry wrote:

> So far I have taken two mobos apart.
> One of the CPU chips was bonded to the heat sink. The other was left
> in the socket.
>
> Which is more common?

Think it through. The typical way of inserting a CPU is to first mount it
in the ZIF socket. Thermal compound is applied next and then the heatsink.
Removal should be the reverse unless, of course, the thermal compound has
bonded to the heatsink. In this case, to prevent damage to the CPU pins,
remove the CPU with the attached heatsink and then remove the heatsink
very carefully. A warm CPU might soften the thermal compound.

On Sat, 04 Aug 2007 00:32:38 -0700, Mistoffolees
<mistyfac01@danang.rvn> wrote:

>
>Terry wrote:
>
>> So far I have taken two mobos apart.
>> One of the CPU chips was bonded to the heat sink. The other was left
>> in the socket.
>>
>> Which is more common?
>
>Think it through. The typical way of inserting a CPU is to first mount it
>in the ZIF socket. Thermal compound is applied next and then the heatsink.
>Removal should be the reverse unless, of course, the thermal compound has
>bonded to the heatsink. In this case, to prevent damage to the CPU pins,
>remove the CPU with the attached heatsink and then remove the heatsink
>very carefully. A warm CPU might soften the thermal compound.

Well I was thinking it through. I guess the ZIF is designed to
release the chip (with great force?) (with little force?) even without
unlatching it.

Before yanking on the heat sink, twist it to break the bond with the
CPU. Then the heat sink can be easily removed.

On Fri, 03 Aug 2007 20:50:28 -0400, Terry <Kilowatt@charter.net>
wrote:

>So far I have taken two mobos apart.
>One of the CPU chips was bonded to the heat sink. The other was left
>in the socket.
>
>Which is more common?

On Aug 4, 2:17 pm, Andy <1...@2.3> wrote:
> Before yanking on the heat sink, twist it to break the bond with the
> CPU. Then the heat sink can be easily removed.

And it will probably take a lot of twisting an gentle pulling - that
stuff's like glue (as it should be).
--
"Your estimated wait time is 8 minutes; you're actual wait time may
vary." MS tech support.

Terry wrote:
> On Sat, 04 Aug 2007 00:32:38 -0700, Mistoffolees
> <mistyfac01@danang.rvn> wrote:
>
>
>>Terry wrote:
>>
>>
>>>So far I have taken two mobos apart.
>>>One of the CPU chips was bonded to the heat sink. The other was left
>>>in the socket.
>>>
>>>Which is more common?
>>
>>Think it through. The typical way of inserting a CPU is to first mount it
>>in the ZIF socket. Thermal compound is applied next and then the heatsink.
>>Removal should be the reverse unless, of course, the thermal compound has
>>bonded to the heatsink. In this case, to prevent damage to the CPU pins,
>>remove the CPU with the attached heatsink and then remove the heatsink
>>very carefully. A warm CPU might soften the thermal compound.
>
>
> Well I was thinking it through. I guess the ZIF is designed to
> release the chip (with great force?) (with little force?) even without
> unlatching it.
>

Freeing the latch and even releasing it even slightly should allow the
CPU to be removed by pulling straight-up. But as Mistoffolees mentioned,
the thermal compound bonding should soften if the CPU is warm and just
breaking the seal between the heatsink and the CPU's heat slug would be
sufficient at removing the heatsink. An X-Acto blade is sharp enough and
strong enough to gently undo the bonding. If one is a good surgeon, it
can be done with the CPU and heatsink still in the ZIF socket.